e 3 ds13002 rev. 13 - 2 1 of 3 b120/b-b160/b www.diodes.co m ? diodes incorporated b120/b - b 160/b 1.0a surface m ount schottky barrier recti fier maximum ratings and elect rical char acterist ics @ t a = 25c unless otherwise s pecified guard ring die construc tion for transient protection ideally suited for automatic assembly low power loss, high efficiency surge overload rating to 30a peak for use in low voltage, high frequency inverters , free wheeling, and pol arity protection application lead free finish / rohs compliant (note 3) mechanical data case: sma/smb case material: molded pl astic. ul flamm ability classification rating 94v-0 moisture sensitivity: level 1 per j- std-020c terminals: lead free plating (matte tin finish). solderable per mil-std-202, method 208 polarity: cathode band or cathode notch marking information: see page 3 ordering information: see page 3 approximate weight: sma 0.064 grams smb 0.093 grams no suffix designates sma package ?b? suffix designates smb package single phase, half wave, 60hz, resistive or inductive load. for capac itive load, derate current by 20% . dim sma smb min max min max a 2.29 2.92 3.30 3.94 b 4.00 4.60 4.06 4.57 c 1.27 1.63 1.96 2.21 d 0.15 0.31 0.15 0.31 e 4.80 5.59 5.00 5.59 g 0.10 0.20 0.10 0.20 h 0.76 1.52 0.76 1.52 j 2.01 2.62 2.00 2.62 all dimensions in m m a b c d g h e j characteristic symbol b120/b b130/b b140/b b150/b b160/b unit peak repetitive revers e voltage working peak revers e voltage dc blocking voltage v rrm v rwm v r 20 30 40 50 60 v rms reverse voltage v r (rms) 14 21 28 35 42 v average rectified output curr ent @ t t = 130c i o 1.0 a non-repetitive peak forwar d surge current 8.3ms single half sine-wave superimposed on r ated load i fsm 30 a forward voltage @ i f = 1.0a v fm 0.50 0.70 v peak reverse cur rent @ t a = 25c at rated dc blocking voltage @ t a = 100c i rm 0.5 10 ma typical total capacitance (n ote 2) c t 110 pf typical thermal resistanc e junction to terminal (note 1) r q jt 20 c/w operating and storage temperature range t j , t stg -65 to +150 c notes: 1. thermal resistance: junc tion to ter minal, unit mounted on pc board with 5.0 mm 2 (0.013 mm thick) copper pads as heat sink. 2. measured at 1.0 mhz and applied reverse v oltage of 4.0v dc. 3. rohs revision 13.2.2003. high temperature solder exemption applied, see eu directive annex n ote 7. features
ds13002 rev. 13 - 2 2 of 3 b120/b-b160/b www.diodes.co m 0 .1 1 .0 1 0 0 .2 0 .4 0 .6 0 .8 1 .0 1 .2 i , i n s t a n t a n e o u s f w d c u r r e n t ( a ) f v , in s t a n t a n e o u s f o rwa r d v o l t a g e ( v ) f f ig . 2 t y p ic a l f o r w a r d c h a r a c te r is ti c s - b 1 2 0 /b t h r u b 1 4 0 /b t = + 2 5 c a t = + 7 5 c a t = + 1 2 5 c a t = - 2 5 c a 0 .0 1 0 .1 1 .0 1 0 0 0 .2 0 .4 0 .6 0 .8 1 .0 i , i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) f v , in s t a n t a n e o u s f w d v o l t a g e ( v ) f f ig . 3 t y p . f o rw a rd c h a ra c te ri s ti c s - b 1 5 0 /b t h ru b 1 6 0 /b i p u ls e w id th = 3 0 0 m s f t = + 1 2 5 oc a t = + 2 5 oc a 1 0 2 0 3 0 4 0 0 1 1 0 1 0 0 i , p e a k f o r w a r d s u r g e c u r r e n t ( a ) f s m f ig . 4 m a x n o n - r e p e ti ti v e p e a k f w d s u r g e c u r r e n t n u m b e r o f c y c l e s a t 6 0 h z s in g le h a lf s in e -w a v e 1 0 1 0 0 1 0 0 0 0 .1 1 1 0 1 0 0 c , t o t a l c a p a c i t a n c e ( p f ) t v , r e v e r s e v o l t a g e ( v ) r f ig . 5 t y p ic a l t o t a l c a p a c it a n c e t = 2 5 c j f = 1 m h z 0 0 .5 1 .0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 i a v e r a g e r e c t i f i e d c u r r e n t ( a ) o , t , t e r m in a l t e m p e r a t u r e ( o c ) t f ig . 1 f o rw a rd c u rr e n t d e ra ti n g c u rv e 1 0 0 1 0 1 0 .1 0 .0 1 1 0 0 0 1 0 ,0 0 0 0 2 0 4 0 v , in s t a n t a n e o u s r e v e r s e v o l t a g e ( v ) r f ig . 6 t y p ic a l r e v e rs e c h a ra c te ri s ti c s , b 1 2 0 /b t h ru b 1 4 0 /b 1 0 3 0 5 0 t = + 25 c a t = + 12 5 c a t = - 25 c a t = +7 5 c a
b 1 = m a n u fa c tu re rs ? c o d e m a rk in g y w w = d a te c o d e m a rk in g y = l a s t d ig it o f y e a r e x : 2 f o r 2 0 0 2 w w = w e e k c o d e 0 1 t o 5 2 x 0 = p ro d u c t ty p e m a rk in g c o d e , e x : b 1 2 0 ( s m a pa c k a g e ) b 1 x 0 b = p ro d u c t ty p e m a rk in g c o d e , e x : b 1 6 0 b ( s m b pa c k a g e ) y w w b 1 x 0 ( b ) ds13002 rev. 13 - 2 3 of 3 b120/b-b160/b www.diodes.co m 1 0 0 1 0 1 0 .1 1 0 0 0 1 0 ,0 0 0 0 2 0 4 0 6 0 7 0 v , in s t a n t a n e o u s r e v e r s e v o l t a g e ( v ) r f ig . 7 t y p ic a l r e v e rs e c h a ra c te ri s ti c s , b 1 5 0 /b t h ru b 1 6 0 /b 1 0 3 0 5 0 t = + 25 c a t = + 12 5 c a t = +7 0 c a (note 4) orderi ng inform ation device* packaging shipping b1xx-13- f sma 5000/tape & reel b1xxb-13- f smb 3000/tape & reel notes: 4. for packaging details, go to our website at http: //www.diodes.com/ datasheets /ap02007. pdf . * xx = device type, e.g. b120-13-f (sma package); b120b-13-f (smb pack age). note: device has a c athode band (as shown abov e) and may also have a c athode notch (as s hown on page 1). i m p o r t a n t n o t i c e d i o d e s i n c o r p o r a t e d a n d i t s s u b s i d i a r i e s r e s e r v e t h e r i g h t t o m a k e m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , c o r r e c t i o n s o r o t h e r c h a n g e s w i t h o u t f u r t h e r n o t i c e t o a n y p r o d u c t h e r e i n . d i o d e s i n c o r p o r a t e d d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g o u t o f t h e a p p l i c a t i o n o r u s e o f a n y p r o d u c t d e s c r i b e d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y l i c e n s e u n d e r i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f p r o d u c t s i n s u c h a p p l i c a t i o n s s h a l l a s s u m e a l l r i s k s o f s u c h u s e a n d w i l l a g r e e t o h o l d d i o d e s i n c o r p o r a t e d a n d a l l t h e c o m p a n i e s w h o s e p r o d u c t s a r e r e p r e s e n t e d o n o u r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s . l i f e s u p p o r t d i o d e s i n c o r p o r a t e d p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u p p o r t d e v i c e s o r s y s t e m s w i t h o u t t h e e x p r e s s e d w r i t t e n a p p r o v a l o f t h e p r e s i d e n t o f d i o d e s i n c o r p o r a t e d . marking i nformat ion
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